PCB Layout and Design Services
MADPCB provides PCB design and layout services to clients worldwide through gathering talent PCB designers with over 10 years' experience in this field. We are able to layout and design all types rigid /flex/ rigid-flex printed circuit boards. As a PCB and assembly manufacturer as well, we have better understanding of how to design a manufacturable, reliable and cost-effective PCB board than others. At MADPCB, you can enjoy one-stop PCB solution service from PCB design to finished prototype and high volume assembled devices.
PCB Design & Layout Services Provided
Schematics (pdf, sketch, etc.) converted to electronic CAD format
Design rules communicated at the schematic level
Custom footprint design to meet your needs
Fabrication Drawings, Assembly and Gerber files to meet manufacturing requirements
Rigid/Flex PCB's; complex board shapes can be created
Routing upon your shematics and specified outline
PCB Reverse Engineering from PCB or PCBA samples provided
PCB Layer stack drawings
Fabrication files (standard format is Gerber Extended & ODB++)
Rout and Drill files
Pick and Place files (Centriod or Coordinates Date)
Fabrication sepcifications (Layer Stack-up, Drill Tables, Impedance Controlled Table and Drawings, etc.)
Complete Bill of Materials (BOM)
Other customer specified outputs
MAD PCB Design Capabilities
Single-sided, double-sided and multi-layer printed circuit boards.
Rigid PCBs and flexible circuits.
Rigid multi-layer printed circuit board design up to 30 layers.
High-speed signal integrity analysis.
Auto test equipment (ATE).
Schematic driven designs.
Impedance control designs.
Differential pair routing and equal length routing.
Surface mounting, through-hole, mixed technology.
Blind vias, buried vias, filled vias, back drilled vias.
Design for manufacturability (DFM) and design for testability (DFT).
PCB Layout Software MADPCB Supports
PADS (Mentor Graphics)
Allegro & OrCAD (Cadence)
Altium Designer (Altium)
MAD PCB Layout Introduction
Mark all documents with date and reference number("yymmdd_Rev01")
Preferred format for drawings is .pdf
Preferred format for BOM is .xsl and .xlsx
Preferred format for instructions is .doc
2. Outline Drawing
Show a top-side view. If required for clarity, add bottom and/or side views.
Show all dimensions for external perimeter and any internal cutouts.
Indicate the board thickness.
Show all board mounting holes. Indicate hole size or size of fasteners.
Show position of all fixed-location parts (connectors, LEDs, switches, etc.).
Show all keep-out areas. Indicate the restriction type: "no parts, no copper, and indicate board side: top, bottom, both".
Iftall components must be positioned to avoid interference with adjacent assemblies, add dimensioned height zones.
3. BOM or Part List
List every part including electrical parts and non-electrical parts (heatsinks, etc.).
Show manufacturer's complete part number, and indicate the manufacturer name for those parts not found on Digi-key / Mouser / Newark and other famous parts distributors' website.
Exception: common ceramic chip components may use "0402, 0603, 0805" in place of the complete part number.
4. Schematic Drawing*
Output a netlist from schematic tool. Preferred format is "PADS-Ascii" or "PADS-2000". Other formats can be converted.
If analog and digital grounds are to be kept separately and joined at a single point, ensure these are shown as two separate nets.
Ideally, set your schematic tool to output manufacturer part numbers in the part description field. Doing so will avoid having to update these fields from the BOM later.
Drawings: Confirm whether our standard drawings format is acceptable, or not. If not, please provide us your drawing template.
EMC If the assembly must meet emissions standards, the mitigation features must be discussed prior to layout. The positioning of circuit blocks is driven by several factors:
(1) Schematic flow
(2) Isolation/segregation goals
(3) Specific customer requests
(4) Realities of available area
If you want a specific layout, just provide MADPCB a simple block diagram.
Grounding: Describe any special grounding requirements, especially single point grounding.
High Speed: Describe any signal integrity requirements, such as differential pairs, matched lengths, and controlled impedance.
Isolation: Describe any voltage isolation requirements.
Part Numbers: Provide the board part number, assembly number, rev numbers/letters, and company name/logo. Unless otherwise specified, we place the board part number in bottom side copper, the assembly number and company name on the top side silkscreen.
Safety: If the board assembly will be used in any class of device for which specific safety criteria are mandated, need to provide the details.
Segregation: Describe circuit segregation requirements, such as separation of low-level analog from noisy switching circuits. Identify sensitive circuitry and noise generators.
Test: Decide whether the board must have 100% nodal test access for ATE.
Text Items: Describe any text items to appear in silkscreen ink. Examples: connectors' pin 1, functional labels at pots, at option jumpers, and at connector pins.
Thermal: Describe any thermal management requirements, such as heatsink areas for specific components.