PCB Materials

MADPCB only selects the well-known and reliable PCB material suppliers to manufacture PCBs for our customers. Generally, printed circuit boards include FR-4 PCB, Aluminum PCB, flex PCB with PI or PET, rigid-flex PCB, CEM-1 PCB and CEM3 PCB. In this PCB Material Sheet, there is always a kind of material suitable to your application.


                                                                    MAD PCB Material Sheet


Vendor

Product

Type

Arc Resistance     Min.(sec.)

Glass Transition Temperature “Tg” (℃)

Degradation Temperature by TGA (℃)

Dielectric Constant(1 MHz

Dielectric Constant (1 GHz)

Loss Tangent(1 MHz)

Loss Tangent

(1 GHz)



SHENGYI

S1000

Low CTE FR4

100

175

335

4.8

-

(1 GHz)

-


S1130

FR4

115

135

-

4.6

-

0.016

-


S1141

FR4

115

140

-

4.5

-

0.016

-


S1155

FR4/Halogen Free

115

135

-

4.7

-

0.01

-


S1165

FR4/Halogen Free

127

170

260

4.8

-

0.007

-


S1170

FR4

123

175

340

4.6

-

0.012

-


S1600

High CTI FR4

126

135

-

4.7

-

0.016

0.008


S1860

FR4

90

210

-


3.6

-

0.008


S1440

FR4/UV Block

125

140

-

4.7

-

0.0015

-


S2130

CEM-3

115

132

-

4.6

-

0.0016

-


S3110

CEM-1

118

110

-

4.4

-

0.022

-


KB

KB-6165GC

FR4/Halogen Free /CTI 600

-

155

325

≤5.4

-

≤0.035

-


KB-6165G

FR4/Halogen Free

≥60

150

360

≤5.4

-

≤0.035

-


HF-140

FR4/Halogen Free


130

340

≤5.4

-

≤0.035

-


KB-6150 / 6160

FR4

≥60

130

-

≤5.4

-

≤0.035

-


KB-6150/6150C

FR4

≥60

130

-

≤5.4

-

≤0.035

-


KB-6160/6160A

FR4

≥60

130

-

≤5.4

-

≤0.035

-


/6160C


KB-6164

FR4

≥60

140

305

≤5.4

-

≤0.035

-


KB-6164F

FR5

≥60

140

310

4.8-5.0

-

≤0.035

-


KB-6165

FR-4

≥60

150

325

5.4

-

≤0.035

-


KB-6165F

FR-4

≥60

150

325

4.8-5.0

-

≤0.035

-


KB-6167F

FR-4

≥60

170

340

4.8-5.0

-

≤0.035

-


KB-6168

FR-4

≥60

170

340

≤5.4

-

≤0.035

-


KB-1150

XPC/JIS:PP7

-

-

-

5.5

-

-

-


CTI>150


KB-3153

FR-1/JIS PP7F

-

-

-

5.3

-

-

-


CTI 600


KB-2150

FR-2/JIS PP3F

-

-

-

5.3

-

-

-


CTI 175


KB-5152

22F

≥60

-

-

5.4

-

≤0.035

-


KB-5150L

CEM-1

≥60

-

-

5.4


≤0.035

-


KB-7150/7150C

CEM-3

≥60

-

-

5.4


≤0.035

-


HONG TAI

HTE-420

FR4

120

145

-

4.2-4.8

-

0.019

-


HTE-740

FR4

120

175

-

4.2-4.8

-

0.019

-


ISOLA

ED130UV

FR4

100

135

-

4.7

4.34

0.02

0.016


FR406

FR4

60

170

295

-

-

-

-


FR408

FR4

120

180

370

-

3.63

-

0.013


P95

Polymide

131

260


4.4

4.2

0.016

0.014


Policlad 370HR

FR4

115

180

350

4.7

4.5

0.016

0.017


Getek

PPO

>60

175-185

-

3.6-4.2

-

.010-.015

-


IS-410

FR4

129

180

350

-

-

-

-


ITEQ

IT140

FR4

60

135

305

5.4

-

0.035

-


IT140G

FR4/Halogen Free

90

155

365

4.5

-

0.015

-


IT158

Low CTE FR4

125

155

345

4.6

-

0.016

-


IT170G

FR4/Halogen Free

100

180

380

4.5

-

0.009

-


IT180

FR4

60

170

340

4.4

-

0.016

-


IT600

High CTI FR4

60

140

305

4.8

-

0.018

-


NAN YA

NP-140

FR4

-

140

311

-

4.2

-

0.015


NP-170TL

FR4

-

175

312

-

4.22

-

0.013


NPG-170

FR4/Halogen Free

90

170

355

-

4.3

-

0.012


NP-180

FR4

120

180

359

-

4.36

-

0.019


NPG-180

FR4/Halogen Free

-

180

380

-

4.8

-

0.016


NELCO

N4000-13

PPE

123

210-240

350

3.8

3.7

-

0.014


N4000-13 SI

PPE

123

210-240

350

-

3.5

-

0.009


N4000-2

FR4

65

130-140

300

4.4

-

0.027

-


N4000-6

FR4 High Temp

65

170-175

300

4.3

4.1

0.027

-


N4000-7

FR4

124

155

317

4.5

4

0.017

0.017


N5000

BT

118

185-220

334

3.8

3.6

-

0.014


N7000-1

Polymide

136

250-260

389

3.9

3.9

-

0.015


ROGERS

RO 3003

PTFE

-

-

500

-

3

-

0.0013


RO 4003C

Ceramic

-

280

425

-

3.38

-

0.0027


RO 4350B

Ceramic

-

280

390

-

3.48

-

0.0037


RO 4450B

Ceramic

-

>280

-

-

3.54

-

0.004


RO TMM3

Ceramic

-

>280

425

-

3.27

-

0.002


RO TMM4

Ceramic

-

>280

425

-

4.5

-

0.002


Ultralam 2000

PTFE

185

-

-

-

2.6

-

0.0022


ARLON

25N

Ceramic

-

260

-

-

3.38

-

0.0025


25FR

Ceramic

-

260

-

-

3.58

-

0.0035


85N

Polyimide

-

260

-

4.39

-

0.008

-


TACONIC

TLC

PTFE

>180

-

-

-

3.2

-

0.003


TLE

PTFE

>180

-

-

-

2.95

-

0.0028


TLT

PTFE

>180

-

-

-

2.5

-

0.0006


TLX

PTFE

>180

-

-

-

2.5

-

0.0019


DUPONT

PYRALUX AC

Polyimide

-

-

-

3.7

-

0.014

-


PYRALUX AP

Polyimide

-

220

-

3.4

-

0.003

-


TAIFLEX

2LPSE 1005

Polyimide

-

-

-

3.65

-

0.009

-


THKD050513

Polyimide

-

-

-

3.65

-

0.009

-




FR-4 (or FR4) is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing). "FR" stands for flame retardant, and denotes that safety of flammability of FR-4 is in compliance with the standard UL94V-0. The default Glass Transition Temperature is 130.

 

Aluminum Printed Circuit Board is also named Aluminum clad, Metal clad (MCPCB), Thermally conductive PCBs, Insulated Metal Substrate (IMS or IMPCB), aluminum base PCB, etc., is often used in LED lighting products and power hybrid IC (HTC),it is a metal-based CCL which has good heat dissipation function. Normally, single sided board is consisted of three layers: circuit layer (copper foil), insulation layer and metal substrate. The default thermal conductivity we use is 1W/m*K.

 

PI stands for Polyimide, and PET stands for Polyester. Both these two kind materials are the ones to fabricate Flex PCB (FPC). Allowing the board to conform to a desired shape, to flex during its use, or to decrease the size, FPCs have potential to replace multiple rigid boards and/or connectors, and it is increasingly applied to flexible electronics (/flex circuits), such as wearable devices and Visual Reality devices.

 

Ceramic PCB has its unique excellent performance, such as high pressure, high insulation, high frequency, high temperature, high reliable and minor volume electronic devices. Working temperature: -55~850. High thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO.

 

CEM stands for Composite epoxy materials, which are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in low-end printed circuit boards. CEM-1 is always used in single-layer PCB, and CEM-3 is always used in double-sided PCB.