PCB Manufacturing Capacities

MADPCB lists the major pcb manufacturing capabilities below for reference. Our PCB fabrication process provides you with everything you need to design and produce high-quality printed circuit boards. About shipping date, please refer to PCB Delivery Time Table.


Item

Mechanical

Standard

Advanced

1

Max PCB Layer Count

20Layer

32Layer

2

Max PCB Thickness

0.157'' (4mm)

0.250'' (6.35mm)

3

Max PCB Size of 1L Aluminum PCB

24'' x 47.24'' (610 x 1200mm)

24'' x 59'' (610 x 1500mm)

4

Max PCB Size of 2L PCB

24'' x 47.24'' (610 x 1200mm)

24'' x 47.24'' (610 x 1200mm)

5

Max Size of Multilayer PCB

20.5" x 24" (521 x 610mm)

20.5" x 24.5" (521 x 622mm)

6

Max Size of Multilayer Metal Core PCB

20.5" x 24" (521 x 610mm)

20" x 24" (508 x 622mm)

7

Max Size of Ceramic PCB

3.937" x 3.937" (100 x 100mm)

3.937" x 3.937" (100 x 100mm)

8

Min Hole Size of CNC Drilling

10mil

10mil

9

Min Hole Size of Laser Drilling

4mil

4mil

10

Min Hole Size for PTFE

10mil

10mil

11

Min Mechanical Buried &Blind Vias Size

12mil

12mil

12

Min Metallized Half Hole Size

12mil

12mil

13

Min Hole Size for Metal Core PCB

39.37mil

39.37mil

14

Aspect Ratio of Normal PCB Board

10:1

12:1

15

Aspect Ratio of Laser Buried &Blind Vias

1:1

0.9:1

16

Aspect Ratio of Mechanical Buried &Blind Vias

1.3:1(dia.8mil)

0.8:1(dia.10mil)

1.15:1(dia.10mil)

0.8:1(dia.10mil)

17

Min Component Pitch

20mil

16mil

18

Min Core Thickness

3mil

2mil

19

Jump Scoring

Yes

Yes

20

Countersink

Yes

Yes

21

Counterbores

Yes

Yes

22

Outline Tolerance

+/-5mil

+/-4mil

23

V-cut Tolerance

+/-4mil

+/-4mil

24

Warpage

0.75%

0.50%

Item

Copper Weight

Standard

Advanced

25

Inner Layers

10oz

10oz

26

Outer Layers

10oz

12oz

Item

Technology

Standard

Advanced

27

Impedance Control

+/-10%

+/-5%

28

Vias Technology

Blind/Buried

Blind/Buried

29

Laser Drilling (Micro Vias)

Yes

Yes

30

Plasma Etching

Yes

Yes

31

Laser Direct Imaging

Yes

Yes

32

Vias Filling

Non-conductive

Conductive

Item

Surface Finish

Thickness 1

Thickness 2

33

HASL

Tin: 2-40μm

Min Thickness of Mass Tin Surface: 0.4μm

34

HASL Lead Free (HALF)

Tin: 2-40μm

Min Thickness of Mass Tin Surface: 1.5μm

35

Immersion Gold (ENIG)

Au: 0.05-0.10μm

Ni: 3-8μm

36

Immersion Silver

Silver: 0.2-0.4μm

N/A

37

ENEPIG

Au: 0.05-0.10μm; Ni: 3-8μm

Pa: 0.05-0.15μm

38

Electroplated Gold Finger

Min Required Au: 0.25-1.5μm

Ni: 3μm

39

Immersion Tin

Tin: 1.0μm

N/A

40

Flash Gold

Au: 0.025-0.10μm; Ni3μm

(Max Base Copper: 1oz)

41

Hard Gold

Au: 0.10-4.0μm

N/A

42

Soft Gold

Au: 0.10-4.0μm

N/A

43

OSP (Entek)

0.2-0.6μm

N/A

44

Carbon Oil

10-50μm

N/A

45

Solder Mask
(on Mass Copper Surface: 10-18μm)

Vias Tenting: 5-8μm

Trace Shoulder:5μm

Item

Plane Layer Clearance

Standard

Advanced

46

PTH & NPTH Hole Clearance to Plane

30mil Larger than Finished Hole Size

24mil Larger than Finished Hole Size

47

PTH & NPTH Hole to Inner Layer Trace

15mil Spacing

12mil Spacing

Item

Annular Ring

Standard

Advanced

48

Min Internal Pad Size

16mil Larger than Finished Hole Size

14mil Larger than Finished Hole with Teardrop

49

Min External Pad Size

16mil Larger than Finished Hole Size

14mil Larger than Finished Hole with Teardrop

Item

Line Width and Spacing

Standard

Advanced

50

Inner Layer Line Width on Hoz Copper

Min 3/3mil

Min 3/3mil

51

Inner Layer Line Width on 1oz Copper

Min 3/4mil

Min 3/4mil

52

Inner Layer Line Width on 2oz Copper

Min 4/5.5mil

Min 4/5mil

53

Inner Layer Line Width on 3oz Copper

Min 5/10mil

Min 5/8mil

54

Inner Layer Line Width on 4oz Copper

Min 6/13mil

Min 6/11mil

55

Inner Layer Line Width on 5oz Copper

Min 7/16mil

Min 7/14mil

56

Inner Layer Line Width on 6oz Copper

Min 8/18mil

Min 8/16mil

57

Inner Layer Line Width on 7oz Copper

Min 9/21mil

Min 10/22mil

58

Inner Layer Line Width on 8oz Copper

Min 10/24mil

Min 10/22mil

59

Inner Layer Line Width on 9oz Copper

Min 11/27mil

Min 11/25mil

60

Inner Layer Line Width on 10oz Copper

Min 12/30mil

Min 12/28mil

61

Outer Layer Line Width on 1/3oz Copper

Min 3.5/4mil

Min 3/3mil

62

Outer Layer Line Width on Hoz Copper

Min 3.9/4.5mil

Min 3.5/4mil

63

Outer Layer Line Width on 1oz Copper

Min 5/6mil

Min 4.8/5.5mil

64

Outer Layer Line Width on 1.5oz Copper

Min 5/8mil

Min 5/7mil

65

Outer Layer Line Width on 2oz Copper

Min 6/10mil

Min 6/8mil

66

Outer Layer Line Width on 3oz Copper

Min 6/14mil

Min 6/12mil

67

Outer Layer Line Width on 4oz Copper

Min 7.5/17mil

Min 7.5/15mil

68

Outer Layer Line Width on 5oz Copper

Min 9/20mil

Min 9/18mil

69

Outer Layer Line Width on 6oz Copper

Min 10/23mil

Min 10/21mil

70

Outer Layer Line Width on 7oz Copper

Min 11/27mil

Min 11/25mil

71

Outer Layer Line Width on 8oz Copper

Min 12/31mil

Min 12/29mil

72

Outer Layer Line Width on 9oz Copper

Min 13/35mil

Min 13/33mil

73

Outer Layer Line Width on 10oz Copper

Min 14/40mil

Min 14/38mil

74

Feature to Board Edge *excluding tabs

Min 10mil

Min 8mil

75

Feature to Score Edge

Min 20mil

Min 15mil

Item

Solder Mask

Standard

Advanced

76

LPI Conductor Overlap

5mil Larger than Feature Size

4mil Larger than Feature Size

77

LPI Mask Clearance

Min 3mil

Min 2mil

78

LPI Mask Web

Min 5mil

Min 4mil

79

web <4mil between component pins may result in loss of mask between SMT pads.

Item

Silkscreen

Standard

Advanced

80

Silkscreen Ink

Min aperture 8mil

Min aperture 6mil

81

Copper Features (ETCHED TEXT)

Min aperture 10mil

Min aperture 10mil

82

Font Height

Min aperture 65mil

Min Height 45mil

83

Distance from Feature (clipping)

Min aperture 6mil

Min 6mil from Feature


Flex & Rigid-flex PCB Manufacturing Capacities


Parameters

Standard Flex   PCBs

HDI Flex PCBs

Rigid-flex PCBs

Standard Panel Size

250x400mm

100x100mm

250x400mm

Copper Thickness

1/2 OZ

1/3-1/2 OZ

1/3 OZ

Max/Min Insulation Thickness

2mil/0.5mil (50μm/12.8μm)

2mil/0.5mil (50μm/12.7μm)

2mil/0.5mil (50μm/12.8μm)

Final Thickness

2   -100mil (0.05-2.5mm)

2   -100mil (0.05-2.6mm)

2.4   -160mil (0.06-4.1mm)

Layer Count

10L   (to date)

Typical   2L, Max 4L

Up to 4L

Shielding Material

Copper/Silver Ink /Tatsuta/Carbon

Copper/Silver Ink /Tatsuta/Carbon

Silver Foil


Min Line Width/Spacing

Inner 1/2 OZ

4/4mil

4/4mil

4/4mil

Inner 1 OZ

5/6mil

5/5mil

5/6mil

Inner 2OZ

5/7mil

5/6mil

5/7mil

Outer 1/3-1/2OZ

5/5mil

4/4mil

5/5mil

Outer 1OZ

6/7mil

6/6mil

6   /7mil

Outer 2OZ

7/7mil

6/7mil

7/7mil


Via/Drill Size

Min Drill Hole Size

0.008''   (0.2mm)

0.006''   (0.15mm)

10mil   (0.254mm)

Min Via (Laser)Size

5mil   (0.13mm)

1mil   (0.025mm)

N/A

Min Micro Via (Laser)Size

3mil   (0.076mm)

1mil   (0.025mm)

N/A

Min Slot Size

24milx35mil   (0.6x0.9mm)

24milx35mil   (0.6x1.0mm)

24milx35mil   (0.6x0.9mm)

Tooling Tolerance

2mil   (0.051mm)

2mil   (0.051mm)

5mil   (0.13mm)


Min Hole Ring

Inner 1/2OZ

4mil   (0.10 mm)

4mil   (0.10 mm)

4mil   (0.10 mm)

Inner 1OZ

5mil   (0.13 mm)

5mil   (0.13 mm)

5mil   (0.13 mm)

Inner 2OZ

7mil   (0.18mm)

6mil   (0.15mm)

7mil   (0.18mm)

Outer 1/3-1/2OZ

5mil   (0.13 mm)

4mil   (0.10 mm)

5mil   (0.13 mm)

Outer 1OZ

5mil   (0.13 mm)

4mil   (0.10 mm)

5mil   (0.13 mm)

Outer 1OZ

8mil   (0.20mm)

7mil   (0.18mm)

8mil   (0.20mm)


Solder Mask

Solder Mask Bridge Between Dam

5mil   (0.13mm)

4mil   (0.10mm)

10mil   (0.25mm)

Solder Mask Registration

5mil   (0.13mm)

4mil   (0.10mm)

5mil   (0.13mm)

Solder Mask Registration Tolerance

4mil   (0.10mm)

4mil   (0.10mm)

5mil   (0.13mm)


Coverlay

Coverlay Registration

8mil

5mil

10mil

PIC Registration

7mil

4mil

N/A


Stiffener

Stiffener Material

N/A

N/A

Polyimide/FR4

PI Stiffener Registration

10mil   (0.25mm)

10mil   (0.25mm)

10mil   (0.25mm)

PI Stiffener Tolerance

10%

10%

10%

FR4 Stiffener Registration

10mil   (0.25mm)

10mil (0.25mm)

10mil (0.25mm)

FR4 Stiffener Tolerance

10%

10%

10%


Silkscreen/Legend

Min Height

35mil

25mil

Graphic   Overlay

Min Width

8mil

6mil

Graphic   Overlay

Min Space

8mil

6mil

Graphic   Overlay

Registration

+/-5mil

+/-5mil

Graphic   Overlay

Impedance

+/-10mil

+/-10mil

N/A


Surface Finish

ENIG

Ni:   100-200μ'', Au: 1-4μ''

Ni:   100-200μ'', Au: 1-4μ''

Ni:   100-200μ'', Au: 1-4μ''

OSP

8-20μ''

8-20μ''

8-20μ''

Immersion Silver

Silver:   6-12μ''

Silver:   6-13μ''

Silver:   6-12μ''

Gold Plating

Ni:   100-200μ'', Au: 1-5μ''

Ni:   100-200μ'', Au: 1-5μ''

Ni:   100-200μ'', Au: 1-5μ''


SRD (Steel Rule Die)

Outline Tolerance

5mil   (0.13mm)

2mil   (0.051mm)

5mil   (0.13mm)

Min Radius

5mil   (0.13mm)

4mil   (0.10mm)

5mil   (0.13mm)

Inside Radius

20mil   (0.51mm)

10mil (0.25mm)

20mil   (0.51mm)

Min Punch Hole Size

40mil   (1.02mm)

31.5mil   (0.80mm)

40mil   (1.02mm)

Tolerance of Punch Hole Size

+/-2mil   (0.051mm)

+/-1mil

+/-2mil   (0.051mm)

Slot Width

20mil  (0.51mm)

15mil   (0.38mm)

20mil   (0.51mm)

Tolerance of Hole to Outline

+/-3mil

+/-2mil

10mil

Tolerance of Hole Edge to Outline

+/-4mil

+/-3mil

10mil

Min Size of Trace to Outline

8mil

5mil

10mil


Outline Tolerance of Punch

Precision Mould

+/-3mil   (0.08 mm)

+/2mil   (0.05 mm)

+/-3mil   (0.08 mm)

Ordinary Mould

+/-4mil   (0.10 mm)

+/-4mil   (0.10 mm)

+/-4mil   (0.10 mm)

Knife Mould

+/-9mil   (0.23 mm)

+/-8mil   (0.21 mm)

+/-9mil   (0.23 mm)

Hand Cutting

+/-16mil   (0.41 mm)

+/-15mil   (0.38 mm)

+/-16mil   (0.41 mm)

Electrical Test Voltage

50-300V

50-300V

50-300V


In MADPCB, we can manufacture all kinds printed circuit boards. If in any demand, don't hesitate to send your pcb files

to sales@madpcb.com for a quick review and quote.

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