Flex PCB Fabrication Capacit

 

Regular Performance Comparison between PI and PET Substrates

PI

With so many manufacturer, PI films are mostly applied to high reliability products (such as Military, Medical…) and those dymatic bendable products.

PI film manufacturer brand: Kapton, Shengyi, Taiflex...

PET

Has various types with good thermoplasticity.

Advantages:

1 Excellent flexibility in all temperature bands

2. Good electrical property

3. Excellent chemical resistance, specially for hot alkaline liquid

4. Perfect tearing property resistance

5. Extremely high tension strength

1. Cost effective

2. Good tearing resistance

3. Good warpage

4. Good electrical property

5. Good Chemical Resistance

Disadvantages:

1 High hygroscopicity

2. Bigger ratio of expansion and contraction than PET

3. Adhesive limits the high-temperature resistance

1. Weak temperature resistance limits the soldering

2. The polymr gets weakness in very cold environment

3. Easy to burn in atmospheric oxygen environment


Base Material

1

Pure Copper Foil:

0.5oz

1oz

1.5oz

2oz

1ayer Substrate

With Adhesive

Conductor

Adhesive

Dielectric Substrate

Normal Adhesive Thickness:

25μm, 20μm, 15μm, 10μm

Without Adhesive

Conductor

Dielectric Substrate

Dielectric Substrate Thickness

1/2mil, 1mil, 2mil, 3mil, 5mil

Copper Foil

ED

RA

EDHD

1oz, 1/1oz, 1/3oz

2

2layer Substrate

With Adhesive

Conductor

Adhesive

Dielectric Substrate

Adhesive

Conductor

Normal Adhesive Thickness

20μm, 15μm, 13μm, 10μm

Normal Dielectric Substrate Thickness

1/2mil, 1mil, 2mil

Copper Foil

ED

RA

EDHD

1/2oz, 1oz, 2oz

Without Adhesive

Conductor

Dielectric Substrate

Conductor

3

Coverlay

图片2.png

Adhesive:

Dielectric Substrate Thickness:

10μm

15μm

20μm

25μm

35μm

 

 

 

 

 

1/2mil

1mil

2mil

5mil

7mil

4

Liquid Coating

Color

Green, Yellow, Black…

Choosing Conditions

High density SMT pads in your design

5

Shielding Material

Type

a. Silver   foil  b. Silver Ink  c. Copper Foil

Function

Adding shielding layer to prevent exterier EMI

Characteristic Requirements

a. Electric Conductivity

b. Adhesiveness

c. Flexural Endurance

Economical

Cost ranking: copper foil> silver foil> silver   ink.

 

Generally MADPCB suggests using silver foil since its easier processing, better shielding and warpage than other 2 materials. If using silver ink, there is need to print solder mask ink.

6

Stiffener

Material

Specifications

Thickness

PI

Roll Width: 250mm, 500mm

With Adhesive: 3-12mil

PET

Roll Width: 250mm, 500mm

With Adhesive: 3-12mil

FR-4

42"X49"

No Adhesive: 0.1-3.2mm

Stainless Steel Foil

/

No Adhesive: 0.1-2.5mm

Aluminum Foil

/

No Adhesive: 0.1-2.5mm

Function:

1 PI Stiffener -insertion and extraction fingers, but easy to be transformed since it's quite soft.

2. Stainless steel / FR-4 stiffener -support or back-side support strengthen.

3. Aluminum stiffener -heat dissipation.

4. PET stiffener -insertion and extraction fingers in product like PET key panel pcb.

7

Work Temperature

(Min/Max)

PI

PET

-125°C / 200°C

-60°C / 105°C


Flex PCB Manufacturing Capacities:

1

Thickness Tolerance

T≤0.25mm

±0.03mm

0.25<T≤0.5mm

±0.05mm

0.5<T≤1.0mm

±0.10mm

T>1mm

±10% mm

2

Layer Count

1 to 10 layer

3

Min Line W/S

Normal: 4/4 mil

Advanced: 3/3mil

4

Drilling

Min Hole Size: 0.20 mm

Max Hole Size: 6.5 mm

Min PTH SLOT Size: 0.50*1.00mm

Hole Position Precision: PTH Drilling: +/-0.05 mm | NPTH Drilling: +/-0.1mm

PTH Tolerance: +/-0.075 mm PTH Tolerance: +/-0.05 mm

5

Plating

Hole Wall Copper Thickness: 11.5μm+/-3.5μm

Surface Copper Thickness: 10-25μm

Hole Plating Aspect Ratio: 1:7 (manufacturing as heavy copper requirement if there is)

6

Line (Trace)

Min Line W/S: 3mil/3mil(1/2oz), 4mil/4mil(1oz)

Line W/S Tolerance: +/-0.03mm (need evaluation when   has special requirement)

Min Annular Ring: 0.10mm(4mil)

Registration Precision: +/- 0.08mm

Line Film Compensation Value: 0.5oz-0.03mm   1oz-0.04mm

7

Solder Mask

(Coverlay)

Photo imagable solder mask

UV Solder Mask

 

windows edge to pads edge: ≥0.05 mm(2mil)

Solder mask bridge(dam): 0.1mm(4mil)

Solder mask thickness: ≥10μm

windows edge to pads edge: ≥0.05 mm(2mil)

Solder mask bridge(dam): ≥0.2mm(8mil)

Solder mask thickness: ≥10μm

Coverlay windows edge to pad edge: ≥0.1mm(4mil)

8

Silkscreen

Character Aperture: ≥0.15mm

Character Height: ≥0.8 mm

Character Position Tolerance: Standard +/-0.2mm, Min   +/-0.15mm

Character edge to pads edge: ≥0.2 mm

Character edge to hole edge: ≥0.3mm

9

Silver Ink &

PI Coating

Silver ink pattern to outline: ≥0.5mm

PI coating to the silver ink: ≥0.6mm

10

Surface Finishes

ENIG, OSP, Gold Plating, immersion Tin

11

Outline Tolerance

Steel Die Outline Tolerance: standard +/-0.10 mm, Min +/-0.05mm

Cutting Die: +/-0.2mm

Min Punching Hole Size: 0.50mm

Min Punching Hole Position Precision: +/-0.05mm

Max Punching Outline Size: 250*300mm

Min Punching FPC Thickness: 0.05mm

Coverlay Min Punching Hole to Hole: 0.50mm

Min Punching Hole to Board Edge: 0.50mm

3M Adhesive Registration Precision Tolerance: +/-0.3mm

Stiffener Registration Precision Tolerance: +/-0.3mm

12

Testing Capacity

Min Testing Pads Distance(Pitch): 0.6mm

Min Testing Pads Size: 0.25mm