Micro-section Analysis Report

Micro-section Analysis Report

 

NO. 1.0 Basic Customer Information

P/N:


Delivery Date:


Quantity:


Sample Size:


Standard:


Customer P/N:


NO 2.0 Thickness of Copper (Unit: μm)

Specimen Location

pcb micro-section Specimen Location of Pheonixp PCB and PCBA_1.png

Hole Type

Single-point

Average

A

B

C

D

E

F

Max

Min

Ave

Remarks

PTH













ACC


Rej


No. 3.0 Thickness of Soldermask (Unit: μm)

 

 

Thickness of the Soldermask test point

pcb micro-section Specimen Location of Pheonixp PCB and PCBA_2.png

Test Point

Request

Result

Acc

Rej

A





B





C





Exceed Pad Height





No. 10.0 Roughness (Unit: μm)

Request

Actual

Acc

Rej





No. 12.0 Thickness of Copper and Dielectric   (Unit: μm)

Copper Thickness

Dielectric Thickness

Layer

Request

Actual

Layer-Layer

Request

Tolerance

Actual

L1



L1-L2




L2



L2-L3




L3



L3-L4




L4



L4-L5




L5



L5-L6




L6



--

Acc


Rej


No. 13.0 Defect Inspection (Unit: μm)

Item

Request

Actual

Acc

Rej

Wicking





Plating Crack





Resin Recession





Plating Void

Request

Actual

Acc

Rej

Delamination





Smear





Copper Crack





Blistering





Interconnection Separation





Laminate Void





Nail Heading





Acc


Rej



No. 14.0 Final Result

Result:


Checked By:


Date:


Approved By:


Date: